Product Overview
- Designed for high-temperature environments: IR-reflow or Dip Solder, up to 350°C.
- Available in low- and high-thickness options; bright white polyimide with dissipative adhesive and release liner.
- Reinforced topcoat for circuit boards that undergo multiple harsh cleaning cycles.
- Print stays clear and readable without reflow or preheating; minimum character size 4 pt.
- Surface resistance meets ANSI/ESD S541-2008 dissipative ESD packaging range: 10⁴ ~ 10¹¹ ohm.
- UL969 certified; meets MIL-STD-202G Method 215K requirements.
- Operating temperature range: -70°C to 350°C.
- Excellent thermal-transfer print quality, supporting automated labeling.
Product Features
- RoHS, Halogen-free, and UL compliant
- Non-conductive acrylic pressure-sensitive adhesive
- Low triboelectric charging when peeled from the liner
- Withstands high-pressure spray solvent cleaning processes
Product List
General-Purpose High-Temp Labels
| Type | Model | Finish | Color | Facestock | Facestock Thickness | Adhesive | Adhesive Thickness | Description / Application | UL | High Temp | Low Temp | Antistatic | Abrasion | Solvent |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| General-Purpose High-Temp Labels | B-767 | Gloss | White | Polyimide / PI | 2 mil | Acrylic | 1.7 mil | Preferred antistatic PI high-temp label. Suitable for PCBA applications | UL | V | V | V | V | V |
| B-768 | Gloss | White | Polyimide / PI | 1 mil | Acrylic | 1.7 mil | Thinner face-material version of B-767 | UL | V | V | V | V | V | |
| B-797 | Gloss | White | Polyimide / PI | 2 mil | Acrylic | 1.7 mil | Preferred PI high-temp label. Suitable for PCBA; organotin-free | UL | V | V | – | V | V | |
| B-728 | Matte | White | Polyimide / PI | 2 mil | Acrylic | 1.7 mil | PI high-temp label. Suitable for PCBA applications | UL | V | V | – | V | V | |
| B-724 | Frosted | Amber | Polyimide / PI | 2 mil | Acrylic | 1.5 mil | Amber version of B-797 | – | V | V | – | V | V | |
| B-777 | Gloss | White | Polyimide / PI | 2 mil | Acrylic | 1.8 mil | Can be cleaned directly after labeling; no post-label heating required to enhance adhesion | UL | V | V | – | – | V | |
| B-729 | Matte | White | Polyimide / PI | 1 mil | Acrylic | 1.7 mil | Thinner face-material version of B-728 | UL | V | V | – | V | V | |
| B-416A | Gloss | White | Polyimide / PI | 1 mil | Acrylic | 1.2 mil | Economical alternative to B-797. Uses thinner face material | UL | V | V | – | V | V | |
| B-719 | Matte | White | Polyimide / PI | 1 mil | Acrylic | 1.5 mil | Matte version of B-768 | UL | V | V | V | V | V |
Functional High-Temp Labels
| Type | Model | Finish | Color | Facestock | Facestock Thickness | Adhesive | Adhesive Thickness | Description / Application | UL | High Temp | Low Temp | Antistatic | Abrasion | Removable |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Functional High-Temp Labels | S-3027 | Frosted | White | Polyimide / PI | 1.6 mil | Acrylic | 1 mil | Double-sided antistatic high-temp label. For PCBA full-process traceability labels and ESD-sensitive component marking | – | V | – | V | V | – |
| S-3012 | Gloss | White | Polyimide / PI | 2 mil | Acrylic | 0.8 mil | Surface antistatic high-temp label. For PCBA full-process traceability labels | – | V | V | V | V | – | |
| S-3033EB | Frosted | White | Polyimide / PI | 2 mil | Acrylic | 0.8 mil | Surface antistatic patterned-adhesive high-temp label. For PCBA full-process traceability labels | – | V | V | V | V | – | |
| B-8088A | Frosted | White | Polyimide / PI | 1 mil | Acrylic | 1 mil | Full-construction UL94 VTM-0 flame-retardant high-temp label. Organotin-free. For PCBA full-process traceability labels | UL 94 VTM0 | V | – | – | V | – | |
| S-3007 | Frosted | White | Polyimide / PI | 1 mil | Silicone | 1 mil | Surface antistatic high-temp removable label. For multilayer PCB process management | – | V | V | V | V | V |
Expert Advice Fast Response
Whether you have questions about Label Jet products or services, or need professional advice and technical support, we warmly welcome your email or call. Our team will respond with expertise and speed to help resolve your challenges and achieve your application goals.
Let’s build more efficient, reliable labeling solutions together.